Workshop of Photonics (WoP) offer a revolutionary glass processing technology that solves all conventional method limitations, thus allowing the micro-device industry to choose glass as the key material.

Responding to increasing customers’ needs, WOP has focused on glass microfluidic chip manufacturing with the objective to achieve the best features possible, thus increasing precision to the maximum.

While talking of microfluidics, GLASS, compared to other materials, offers a unique set of features. It is optically transparent, solid, electrically insulating, amorphous, has thermal stability and temperature resistance, chemical inertness to many fluids, biocompatibility, not permeable to gas. All this makes glass an ideal material for microfluidic devices.

And yet, it is not widely selected because conventional manufacturing of glass microfluidic devices is a complex, multi-step process that is not effective nor competitive.

What we offer is a revolutionary glass processing technology that solves all conventional method limitations, thus allowing the micro-device industry to choose glass as the key material.

Our technology is:

  • Ultra-fast >> up to 200x faster
  • Cheap >> up to 40x cheaper than other known conventional glass processing methods
  • Ultra-precise >> offers exceptional precision and quality results on glass

We offer droplet-based microfluidics, microfluidics for point-of-care, single-cell analysis, or any other custom application.

Overall, femtosecond laser micromachining of transparent materials (the one we use) provides many advantages over conventional methods and is ideally suited for the fabrication of microfluidic devices, especially glass ones.

Key features:

  • Material – Glass, Silicon, Polymers (PDMS)
  • Single or multi-layer structures
  • No mold needed – lower prototyping expenses, faster process
  • Feature sizes from 1 μm
  • Low chipping <10 μm, typ. none
  • Smooth sidewalls, Ra<1 μm
  • No debris on the surface – beneficial for bonding
  • Straight or irregular cuts of ultra-high precision
  • Wide range of channel widths and depths are available
  • Up to 10 mm thickness substrates
  • Modification available – laser processing/etching/mechanical

 

 

Lasers & other Sources